US 11,894,333 B2
Semiconductor package
Dahee Kim, Cheonan-si (KR); Jeongrim Seo, Asan-si (KR); and Gookmi Song, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 13, 2021, as Appl. No. 17/401,664.
Claims priority of application No. 10-2020-0159233 (KR), filed on Nov. 24, 2020.
Prior Publication US 2022/0165698 A1, May 26, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 25/10 (2006.01)
CPC H01L 24/20 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 25/105 (2013.01); H01L 2224/214 (2013.01); H01L 2224/2105 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/3512 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a redistribution substrate including a connection via and a redistribution layer electrically connected to each other, and a redistribution pad electrically connected to the redistribution layer by the connection via; and
a semiconductor chip disposed on the redistribution substrate and including a connection pad electrically connected to the redistribution layer,
wherein the redistribution pad has a shape having a plurality of protrusions protruding in directions different to each other in a plan view, and
wherein the redistribution substrate further includes a dummy metal pattern disposed between adjacent redistribution pads.