US 11,894,332 B2
Substrate and package structure
Wei-Hung Lin, Xinfeng Township (TW); Hsiu-Jen Lin, Zhubei (TW); Ming-Da Cheng, Taoyuan (TW); Yu-Min Liang, Zhongli (TW); Chen-Shien Chen, Zhubei (TW); and Chung-Shi Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 28, 2021, as Appl. No. 17/333,754.
Application 17/333,754 is a continuation of application No. 16/199,507, filed on Nov. 26, 2018, granted, now 11,024,594.
Application 16/199,507 is a continuation of application No. 15/242,722, filed on Aug. 22, 2016, granted, now 10,141,281, issued on Nov. 27, 2018.
Application 15/242,722 is a continuation of application No. 14/190,360, filed on Feb. 26, 2014, granted, now 9,425,157, issued on Aug. 23, 2016.
Prior Publication US 2021/0288012 A1, Sep. 16, 2021
Int. Cl. H01L 23/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/17 (2013.01) [H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16013 (2013.01); H01L 2224/16104 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/1701 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17104 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a substrate comprising:
first pads in a core area of the substrate;
second pads in a corner area of the substrate; and
third pads in an edge area of the substrate, the edge area extending around each side of the core area in a top-down view, a widest portion of the third pads having a lesser width than a widest portion of the first pads and a widest portion of the second pads in a cross-sectional view; and
a chip comprising bumps, each of the bumps having a substantially same width as the widest portion of the first pads and the widest portion of the second pads in the cross-sectional view, a first subset of the bumps connected to the first pads of the substrate, a second subset of the bumps connected to the second pads of the substrate, a third subset of the bumps connected to the third pads of the substrate.