CPC H01L 24/17 (2013.01) [H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16013 (2013.01); H01L 2224/16104 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/1701 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17104 (2013.01)] | 20 Claims |
1. A device comprising:
a substrate comprising:
first pads in a core area of the substrate;
second pads in a corner area of the substrate; and
third pads in an edge area of the substrate, the edge area extending around each side of the core area in a top-down view, a widest portion of the third pads having a lesser width than a widest portion of the first pads and a widest portion of the second pads in a cross-sectional view; and
a chip comprising bumps, each of the bumps having a substantially same width as the widest portion of the first pads and the widest portion of the second pads in the cross-sectional view, a first subset of the bumps connected to the first pads of the substrate, a second subset of the bumps connected to the second pads of the substrate, a third subset of the bumps connected to the third pads of the substrate.
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