US 11,894,323 B2
Devices related to dual-sided module with land-grid array (LGA) footprint
Howard E. Chen, Anaheim, CA (US); Robert Francis Darveaux, Corona Del Mar, CA (US); and Anthony James Lobianco, Irvine, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Oct. 4, 2021, as Appl. No. 17/493,720.
Application 16/699,680 is a division of application No. 15/884,374, filed on Jan. 30, 2018, granted, now 10,497,656, issued on Dec. 3, 2019.
Application 17/493,720 is a continuation of application No. 16/699,680, filed on Dec. 1, 2019, granted, now 11,139,257.
Claims priority of provisional application 62/452,340, filed on Jan. 30, 2017.
Prior Publication US 2022/0148984 A1, May 12, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); H05K 1/0243 (2013.01); H01L 23/3128 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side;
a first component mounted on the first side of the packaging substrate;
a first overmold structure implemented on the first side of the packaging substrate, the first overmold structure substantially encapsulating the first component;
a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins;
a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad; and
a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.