CPC H01L 23/50 (2013.01) [H01L 23/3672 (2013.01); H01L 23/49838 (2013.01); H05K 7/209 (2013.01)] | 19 Claims |
1. An apparatus comprising:
an integrated circuit package comprising:
a substrate comprising a first surface and a second surface opposite the first surface;
an integrated circuit coupled to the first surface of the substrate;
a first plurality of signal conductors arranged along a periphery of the first surface of the substrate, the first plurality of signal conductors configured to connect a first plurality of wires to the integrated circuit; and
a second plurality of signal conductors arranged along a periphery of the second surface of the substrate, the second plurality of signal conductors configured to connect a second plurality of wires to the integrated circuit; and
a heatsink configured to absorb heat from the integrated circuit package, the heatsink comprising:
a first portion positioned along the first surface of the substrate; and
a second portion positioned along the second surface of the substrate,
wherein the first plurality of wires and the second plurality of wires extend through a first side of the heatsink and a second side of the heatsink opposite the first side.
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