US 11,894,296 B2
Integrated circuit package with heatsink
Mike Sapozhnikov, San Jose, CA (US); Sayed Ashraf Mamun, San Jose, CA (US); Tomer Osi, Rosh Ahayin (IL); Amendra Koul, San Francisco, CA (US); David Nozadze, San Jose, CA (US); Upendranadh R. Kareti, Union City, CA (US); and Joel R. Goergen, Soulsbyville, CA (US)
Assigned to Cisco Technology, Inc., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Sep. 2, 2021, as Appl. No. 17/446,729.
Claims priority of provisional application 63/201,673, filed on May 7, 2021.
Claims priority of provisional application 63/201,669, filed on May 7, 2021.
Prior Publication US 2022/0359366 A1, Nov. 10, 2022
Int. Cl. H01L 23/50 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/50 (2013.01) [H01L 23/3672 (2013.01); H01L 23/49838 (2013.01); H05K 7/209 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus comprising:
an integrated circuit package comprising:
a substrate comprising a first surface and a second surface opposite the first surface;
an integrated circuit coupled to the first surface of the substrate;
a first plurality of signal conductors arranged along a periphery of the first surface of the substrate, the first plurality of signal conductors configured to connect a first plurality of wires to the integrated circuit; and
a second plurality of signal conductors arranged along a periphery of the second surface of the substrate, the second plurality of signal conductors configured to connect a second plurality of wires to the integrated circuit; and
a heatsink configured to absorb heat from the integrated circuit package, the heatsink comprising:
a first portion positioned along the first surface of the substrate; and
a second portion positioned along the second surface of the substrate,
wherein the first plurality of wires and the second plurality of wires extend through a first side of the heatsink and a second side of the heatsink opposite the first side.