CPC H01L 23/49811 (2013.01) [H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 23/32 (2013.01); H01L 23/562 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 23/3735 (2013.01)] | 20 Claims |
1. A power module, comprising:
pins of a first material coupled at a bottom portion to top metal layer of a direct bonded copper (DBC) substrate and having a top portion extending through pin holes in a casing of the power module, the top portion of the pins configured to be press fit into vias of an electronic substrate; and
support pillars, of a second material, coupled at a first end to the electronic substrate and coupled at a second end to a baseplate onto which a bottom metal layer of the DBC substrate is coupled, the support pillars configured to hold the electronic substrate at a height relative to the pins, the second material of the support pillars having a coefficient of thermal expansion substantially the same as a coefficient of thermal expansion of the first material of the pins.
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