US 11,894,289 B2
Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods
Hong Wan Ng, Singapore (SG); Chin Hui Chong, Singapore (SG); Hem P. Takiar, Fremont, CA (US); Seng Kim Ye, Singapore (SG); and Kelvin Tan Aik Boo, Singapore (SG)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Nov. 7, 2022, as Appl. No. 17/982,397.
Application 17/982,397 is a division of application No. 17/243,466, filed on Apr. 28, 2021, granted, now 11,527,459.
Prior Publication US 2023/0056648 A1, Feb. 23, 2023
Int. Cl. H01L 29/76 (2006.01); H01L 29/00 (2006.01); H01L 23/48 (2006.01); H01L 27/08 (2006.01); H01L 49/02 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/481 (2013.01) [H01L 23/49816 (2013.01); H01L 27/0805 (2013.01); H01L 28/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate, comprising:
first and second pairs of electrical contacts on a first surface of the substrate and configured to receive corresponding first and second surface-mount capacitors in one of two perpendicular orientations,
wherein the first pair of electrical contacts is configured to connect the first surface-mount capacitor to both a first circuit branch of the substrate and to a second circuit branch of the substrate,
wherein the second pair of electrical contacts is configured to connect the second surface-mount capacitor to both the first circuit branch of the substrate and to a third circuit branch of the substrate, and
wherein the first and second pairs of electrical contacts each have an intra-pair spacing corresponding to a first orientation of the two perpendicular orientations and an inter-pair spacing corresponding to a second orientation of the two perpendicular orientations.