CPC H01L 23/42 (2013.01) [H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3157 (2013.01); H01L 23/3185 (2013.01); H01L 23/49816 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 25/0655 (2013.01); H01L 27/0688 (2013.01); H01L 2224/2958 (2013.01)] | 20 Claims |
1. A method of forming a package structure, comprising:
bonding a first die and a second die onto an interposer;
dispensing an underfill layer between the first die and the second die;
forming a first encapsulant to laterally encapsulate the first die, the second die, and the underfill layer;
dispensing a thermal interface material (TIM) on the first die, the second die, the underfill layer, and the first encapsulant, wherein the TIM has an edge thickness greater than a center thickness of the TIM; and
mounting a lid on the TIM, wherein the TIM has a first concave top surface, the lid conformally covers the first concave top surface of the TIM, and the lid has a second concave top surface corresponding to the first concave top surface.
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