US 11,894,287 B2
Adhesive and thermal interface material on a plurality of dies covered by a lid
Chih-Hao Chen, Taipei (TW); Chin-Fu Kao, Taipei (TW); Li-Hui Cheng, New Taipei (TW); Szu-Wei Lu, Hsinchu (TW); and Chih-Chien Pan, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 10, 2023, as Appl. No. 18/181,552.
Application 18/181,552 is a continuation of application No. 17/580,662, filed on Jan. 21, 2022, granted, now 11,626,344.
Application 17/580,662 is a continuation of application No. 16/941,509, filed on Jul. 28, 2020, granted, now 11,239,136, issued on Feb. 1, 2022.
Prior Publication US 2023/0230898 A1, Jul. 20, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/42 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 27/06 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/42 (2013.01) [H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3157 (2013.01); H01L 23/3185 (2013.01); H01L 23/49816 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 25/0655 (2013.01); H01L 27/0688 (2013.01); H01L 2224/2958 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a package structure, comprising:
bonding a first die and a second die onto an interposer;
dispensing an underfill layer between the first die and the second die;
forming a first encapsulant to laterally encapsulate the first die, the second die, and the underfill layer;
dispensing a thermal interface material (TIM) on the first die, the second die, the underfill layer, and the first encapsulant, wherein the TIM has an edge thickness greater than a center thickness of the TIM; and
mounting a lid on the TIM, wherein the TIM has a first concave top surface, the lid conformally covers the first concave top surface of the TIM, and the lid has a second concave top surface corresponding to the first concave top surface.