US 11,894,285 B2
Back plate assembly and electronic device
Jiefeng Zhang, Shanghai (CN); Zhiqiang Li, Shanghai (CN); Biaobing Lv, Shanghai (CN); Guoxiao Shen, Shanghai (CN); Wei Zhao, Shanghai (CN); and Jinqiang Wang, Qingdao (CN)
Assigned to Tyco Electronics (Shanghai) Co., Ltd., Shanghai (CN)
Filed by Tyco Electronics (Shanghai) Co. Ltd., Shanghai (CN)
Filed on Nov. 6, 2020, as Appl. No. 17/090,969.
Claims priority of application No. 201911087320.4 (CN), filed on Nov. 8, 2019.
Prior Publication US 2021/0143083 A1, May 13, 2021
Int. Cl. H01L 23/40 (2006.01); H01L 23/367 (2006.01); H05K 7/10 (2006.01)
CPC H01L 23/4006 (2013.01) [H01L 23/367 (2013.01); H05K 7/1061 (2013.01); H01L 2023/4037 (2013.01); H01L 2023/4087 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a back plate assembly including a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction, a pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove and the arch plate having a length less than a length of the base plate when assembled into the groove;
an electronic component including a circuit board having a bottom side placed directly on the arch plate; and
a connection mechanism mounting the electronic component on the back plate assembly and applying a loading force on the electronic component directed in a vertical direction of the arch plate,
wherein the electronic component includes a socket connector mounted on a top side of the circuit board directly opposite the arch plate, a central processing unit mounted on the socket connector, and a heatsink mounted on the central processing unit.