US 11,894,282 B2
Vented lids for integrated circuit packages
Zhimin Wan, Chandler, AZ (US); Sergio Antonio Chan Arguedas, Chandler, AZ (US); Peng Li, Chandler, AZ (US); Chandra Mohan Jha, Tempe, AZ (US); Aravindha R. Antoniswamy, Phoenix, AZ (US); Cheng Xu, Chandler, AZ (US); Junnan Zhao, Gilbert, AZ (US); and Ying Wang, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 19, 2019, as Appl. No. 16/446,538.
Prior Publication US 2020/0402884 A1, Dec. 24, 2020
Int. Cl. H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 23/053 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 23/053 (2013.01); H01L 23/433 (2013.01); H01L 23/49816 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) package, comprising:
a package substrate;
a die; and
a lid including an interior surface and an exterior surface,
wherein:
the die is between the package substrate and the lid,
the interior surface of the lid is between the die and the exterior surface of the lid,
a plurality of vents extends between the interior surface and the exterior surface,
a number of vents in the plurality of vents is more than ten,
at least one vent in the plurality of vents at least partially overlaps the die,
the interior surface of the lid includes a metal layer,
the metal layer includes gold or silver, and
the metal layer does not extend into the at least one vent.