US 11,894,281 B2
Semiconductor device including lead with varying thickness
Ryota Majima, Kyoto (JP); and Koshun Saito, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by Rohm Co., Ltd., Kyoto (JP)
Filed on Jul. 8, 2021, as Appl. No. 17/370,596.
Application 17/370,596 is a continuation of application No. 16/560,493, filed on Sep. 4, 2019, granted, now 11,088,043.
Claims priority of application No. 2018-165722 (JP), filed on Sep. 5, 2018.
Prior Publication US 2021/0335683 A1, Oct. 28, 2021
Int. Cl. H01L 23/31 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/315 (2013.01) [H01L 23/4952 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor chip;
at least one lead electrically connected to the semiconductor chip;
a sealing resin that covers the semiconductor chip and a part of the lead, the sealing resin including a resin front surface and a resin back surface opposite to the resin front surface in a thickness direction; and
an island portion on which the semiconductor chip is mounted,
wherein the lead includes an end portion formed with a cut-out recessed inward in plan view, while also including a thin-walled portion that is smaller in thickness than a remaining portion of the lead,
wherein the lead includes an upper surface, the end portion of the lead includes a first lower surface, and the thin-walled portion of the lead includes a second lower surface, the second lower surface being offset toward the upper surface of the lead with respect to the first lower surface,
wherein the cut-out is at least partially round in plan view, and
wherein the sealing resin comprises a first resin side surface, a second resin side surface and a third resin side surface each of which is connected to the resin front surface and the resin back surface, and the island portion is formed with a plurality of protrusions each protruding outward from one of the first, second and third resin side surfaces in plan view.