US 11,894,265 B2
Top via with damascene line and via
Lawrence A. Clevenger, Saratoga Springs, NY (US); Brent Anderson, Jericho, VT (US); Kisik Choi, Watervliet, NY (US); Nicholas Anthony Lanzillo, Wynantskill, NY (US); Christopher J. Penny, Saratoga Springs, NY (US); and Robert Robison, Rexford, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Sep. 20, 2021, as Appl. No. 17/479,346.
Application 17/479,346 is a division of application No. 16/743,955, filed on Jan. 15, 2020, granted, now 11,164,777.
Prior Publication US 2022/0005732 A1, Jan. 6, 2022
Int. Cl. H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01)
CPC H01L 21/76843 (2013.01) [H01L 21/76802 (2013.01); H01L 21/76879 (2013.01); H01L 23/5226 (2013.01); H01L 23/53266 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A top via, comprising:
a trench plate on a conductive line wherein a gap is formed between an etch stop layer and the trench plate;
a conductive trench plug on the trench plate;
channel plate on the conducive trench plug;
a conductive channel plug on the channel plate; and
a barrier layer on the conductive channel plug, channel plate, conductive trench plug, and trench plate.
 
10. A top via, comprising:
air etch stop layer on a fill layer;
a conductive line in the fill layer;
a trench plate on a conductive line;
a gap between the etch stop layer and the trench plate;
a conductive trench plug on the trench plate;
a channel plate on the conductive trench plug;
conductive channel plug on the channel plate; and
a barrier layer on the conductive channel plug, channel plate, conductive trench plug, and trench plate.
 
15. A top via comprising:
a first etch stop layer on a fill layer;
a conductive line in the fill layer;
a trench plate on a conductive line, wherein there is a gap between the first etch stop layer and the trench plate;
a conductive trench plug on the trench plate;
a channel plate on the conductive trench plug;
a conductive channel plug on the channel plate; and
a harrier layer directly on the first etch stop layer, conductive line, conductive channel plug, channel plate, conductive trench Ow, and trench plate.