CPC H01L 21/76843 (2013.01) [H01L 21/76802 (2013.01); H01L 21/76879 (2013.01); H01L 23/5226 (2013.01); H01L 23/53266 (2013.01)] | 19 Claims |
1. A top via, comprising:
a trench plate on a conductive line wherein a gap is formed between an etch stop layer and the trench plate;
a conductive trench plug on the trench plate;
channel plate on the conducive trench plug;
a conductive channel plug on the channel plate; and
a barrier layer on the conductive channel plug, channel plate, conductive trench plug, and trench plate.
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10. A top via, comprising:
air etch stop layer on a fill layer;
a conductive line in the fill layer;
a trench plate on a conductive line;
a gap between the etch stop layer and the trench plate;
a conductive trench plug on the trench plate;
a channel plate on the conductive trench plug;
conductive channel plug on the channel plate; and
a barrier layer on the conductive channel plug, channel plate, conductive trench plug, and trench plate.
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15. A top via comprising:
a first etch stop layer on a fill layer;
a conductive line in the fill layer;
a trench plate on a conductive line, wherein there is a gap between the first etch stop layer and the trench plate;
a conductive trench plug on the trench plate;
a channel plate on the conductive trench plug;
a conductive channel plug on the channel plate; and
a harrier layer directly on the first etch stop layer, conductive line, conductive channel plug, channel plate, conductive trench Ow, and trench plate.
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