CPC H01L 21/6833 (2013.01) [H01J 37/32642 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/68721 (2013.01)] | 20 Claims |
10. A process chamber, comprising:
a chamber body having a substrate support disposed within an inner volume of the chamber body, wherein the substrate support includes:
a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate;
a first cooling plate coupled to the second side of the ceramic plate;
a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring,
wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate;
an edge ring disposed on the ceramic ring;
a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is a ring disposed about the first cooling plate with a gap disposed between the first cooling plate and the second cooling plate;
wherein the second cooling plate is thermally isolated from the first cooling plate;
wherein the first cooling plate and the second cooling plate include coolant channels configured to circulate a coolant, wherein the coolant channels of the first cooling plate are fluidly independent from the coolant channels of the second cooling plate;
a first gas channel extending from the first side to the second side of the ceramic plate;
a second gas channel extending from the first side to the second side of the ceramic ring; and
one or more sealing elements disposed between:
the ceramic ring and the second cooling plate;
the first cooling plate and the second cooling plate; and
the ceramic ring and the edge ring, dimensioned and arranged to prevent a gas flow from the second gas channel into the gap disposed between the first cooling plate and the second cooling plate; and
a power source coupled to the heating element to control a temperature of the ceramic ring independent of the temperature of the ceramic plate.
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