US 11,894,246 B2
Bonding apparatus and bonding method
Norio Wada, Koshi (JP); and Shintaro Sugihara, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Aug. 2, 2022, as Appl. No. 17/816,810.
Claims priority of application No. 2021-129086 (JP), filed on Aug. 5, 2021.
Prior Publication US 2023/0039173 A1, Feb. 9, 2023
Int. Cl. B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67092 (2013.01) [H01L 21/6838 (2013.01); H01L 21/68742 (2013.01); B32B 43/006 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1983 (2015.01)] 8 Claims
OG exemplary drawing
 
1. A bonding apparatus, comprising:
a first holder configured to hold a first substrate;
a second holder, disposed at a position facing the first holder, having an attraction surface configured to attract a second substrate to be bonded to the first substrate;
an attracting pressure generator configured to generate an attracting pressure in the attraction surface; and
a lift pin configured to space the second substrate on the attraction surface apart from the second holder,
wherein the second holder is provided with a space including an opening through which the lift pin passes, and
the space is controlled to have a pressure lower than an atmospheric pressure,
wherein the second holder comprises:
a housing forming the space;
a driving unit configured to drive the lift pin; and
a sealing member, disposed between the housing and the driving unit, configured to close a gap between the housing and the lift pin when the first substrate and the second substrate are bonded,
wherein the sealing member is an O-ring seal.