CPC H01L 21/67092 (2013.01) [H01L 21/6838 (2013.01); H01L 21/68742 (2013.01); B32B 43/006 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1983 (2015.01)] | 8 Claims |
1. A bonding apparatus, comprising:
a first holder configured to hold a first substrate;
a second holder, disposed at a position facing the first holder, having an attraction surface configured to attract a second substrate to be bonded to the first substrate;
an attracting pressure generator configured to generate an attracting pressure in the attraction surface; and
a lift pin configured to space the second substrate on the attraction surface apart from the second holder,
wherein the second holder is provided with a space including an opening through which the lift pin passes, and
the space is controlled to have a pressure lower than an atmospheric pressure,
wherein the second holder comprises:
a housing forming the space;
a driving unit configured to drive the lift pin; and
a sealing member, disposed between the housing and the driving unit, configured to close a gap between the housing and the lift pin when the first substrate and the second substrate are bonded,
wherein the sealing member is an O-ring seal.
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