CPC H01L 21/67092 (2013.01) [B21D 11/10 (2013.01); H01L 21/02035 (2013.01)] | 20 Claims |
1. A packaging system comprising:
a wafer; and
a curvature adjustment structure permanently coupled thereto;
wherein the curvature adjustment structure is configured to induce a curvature of a largest planar surface of the wafer.
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