US 11,894,245 B2
Non-planar semiconductor packaging systems and related methods
Michael J. Seddon, Gilbert, AZ (US); and Francis J. Carney, Mesa, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Apr. 29, 2020, as Appl. No. 16/862,294.
Prior Publication US 2021/0343555 A1, Nov. 4, 2021
Int. Cl. H01L 21/67 (2006.01); B21D 11/10 (2006.01); H01L 21/02 (2006.01)
CPC H01L 21/67092 (2013.01) [B21D 11/10 (2013.01); H01L 21/02035 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A packaging system comprising:
a wafer; and
a curvature adjustment structure permanently coupled thereto;
wherein the curvature adjustment structure is configured to induce a curvature of a largest planar surface of the wafer.