US 11,894,241 B2
Heterogeneous bonding structure and method forming same
Mirng-Ji Lii, Sinpu Township (TW); Chen-Shien Chen, Zhubei (TW); Lung-Kai Mao, Kaohsiung (TW); Ming-Da Cheng, Taoyuan (TW); and Wen-Hsiung Lu, Tainan (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 1, 2021, as Appl. No. 17/220,339.
Claims priority of provisional application 63/142,543, filed on Jan. 28, 2021.
Prior Publication US 2022/0238353 A1, Jul. 28, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/4857 (2013.01) [H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/5226 (2013.01); H01L 23/5383 (2013.01); H01L 24/80 (2013.01); H01L 2224/80345 (2013.01); H01L 2224/80355 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming a first package component comprising:
forming a first plurality of openings in a first dielectric layer;
depositing a first metallic material into the first plurality of openings;
performing a planarization process on the first metallic material and the first dielectric layer to form a first plurality of metal pads in the first dielectric layer, wherein one of the first plurality of metal pads comprises edge portions and a middle portion more recessed than the respective edge portions; and
selectively depositing a second metallic material over the first plurality of metal pads to form a first plurality of bond pads, wherein the first plurality of bond pads comprise the first plurality of metal pads and corresponding parts of the second metallic material; and
bonding the first package component to a second package component, wherein before the bonding, the first dielectric layer comprises a first top surface, and the second metallic material comprises a second top surface, and wherein the second top surface comprises a first point lower than the first top surface, and a second point higher than the first top surface, and wherein the first plurality of bond pads are bonded to the second package component.