US 11,894,195 B2
Electronic component
Yoji Tozawa, Tokyo (JP); Masashi Shimoyasu, Tokyo (JP); Makoto Yoshino, Tokyo (JP); Takuo Abe, Tokyo (JP); Akihiko Oide, Tokyo (JP); Tsutomu Ono, Tokyo (JP); Shinichi Sato, Tokyo (JP); Makoto Morita, Tokyo (JP); Shinichi Sato, Tokyo (JP); and Hidekazu Sato, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Nov. 8, 2021, as Appl. No. 17/521,500.
Application 17/521,500 is a division of application No. 15/821,998, filed on Nov. 24, 2017, granted, now 11,227,721.
Claims priority of application No. 2016-227877 (JP), filed on Nov. 24, 2016; and application No. 2017-100068 (JP), filed on May 19, 2017.
Prior Publication US 2022/0068565 A1, Mar. 3, 2022
Int. Cl. H01F 27/32 (2006.01); H01F 27/29 (2006.01); H01G 4/232 (2006.01); H01G 4/252 (2006.01); H01G 13/00 (2013.01); H05K 1/03 (2006.01); H01B 1/22 (2006.01); H01G 4/30 (2006.01); H03H 7/42 (2006.01); H01F 17/00 (2006.01); H01G 4/12 (2006.01); H03H 1/00 (2006.01); H05K 3/34 (2006.01)
CPC H01G 4/2325 (2013.01) [H01B 1/22 (2013.01); H01F 17/0013 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/32 (2013.01); H01F 27/324 (2013.01); H01G 4/232 (2013.01); H01G 4/252 (2013.01); H01G 4/30 (2013.01); H01G 13/006 (2013.01); H03H 7/427 (2013.01); H05K 1/0306 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0093 (2013.01); H01G 4/12 (2013.01); H03H 2001/0057 (2013.01); H03H 2001/0085 (2013.01); H05K 3/3442 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10636 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electronic component comprising:
an element body including a principal surface including a ceramic material and a side surface adjacent to the principal surface, the principal surface being arranged to constitute a mounting surface;
an external electrode including a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface;
a resin film disposed on the principal surface and in contact with the principal surface, and having electrical insulating properties; and
an internal conductor disposed in the element body and including an end exposed at the side surface,
wherein each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body,
the conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film,
the second electrode portion includes a sintered metal layer connected with the end of the internal conductor, the sintered metal layer is disposed on the side surface and is in contact with the side surface,
the conductive resin layer included in the second electrode portion is disposed on the element body in such a manner that the sintered metal layer is disposed between the element body and the conductive resin layer included in the second electrode portion,
the resin film includes an end portion covering an edge of the sintered metal layer, and
the end portion of the resin film is located between the edge of the sintered metal layer and the conductive resin layer and is in direct contact with the edge of the sintered metal layer and the conductive resin layer.