US 11,894,194 B2
Dielectric composition and multilayer ceramic electronic device
Toshihiro Iguchi, Tokyo (JP); Tomoaki Nonaka, Tokyo (JP); and Takeshi Shouji, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Jul. 28, 2022, as Appl. No. 17/876,162.
Prior Publication US 2023/0090201 A1, Mar. 23, 2023
Int. Cl. H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); C04B 35/468 (2006.01); H01G 4/008 (2006.01)
CPC H01G 4/1227 (2013.01) [C04B 35/4682 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/768 (2013.01); C04B 2235/96 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A dielectric composition comprising:
a dielectric grain including a perovskite compound; and
a first segregation phase including at least Ca, Al, Si, and O.