US 11,894,193 B2
Multilayer electronic component
Tae Hyeong Kim, Suwon-si (KR); Moon Soo Park, Suwon-si (KR); Ji Hyun Yu, Suwon-si (KR); and Jin Woo Jang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 27, 2021, as Appl. No. 17/512,076.
Claims priority of application No. 10-2021-0000511 (KR), filed on Jan. 4, 2021.
Prior Publication US 2022/0216008 A1, Jul. 7, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/012 (2006.01)
CPC H01G 4/1227 (2013.01) [H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a plurality of first dielectric layers, an active portion in which internal electrodes are alternately disposed, and a cover portion disposed on the active portion in a first direction of the body, a direction in which the plurality of first dielectric layers are laminated, the cover portion including a second dielectric layer; and
an external electrode disposed externally on the body and connected to one of the internal electrodes,
wherein the body includes a margin portion covering all side surfaces of the one of the internal electrodes other than a side surface connected to the external electrode, and
wherein the margin portion includes a dielectric pattern having a porosity higher than that of one of the plurality of first dielectric layers.