US 11,894,192 B2
Multilayer ceramic electronic component
Seung In Baik, Suwon-si (KR); Hee Sun Chun, Suwon-si (KR); Jae Sung Park, Suwon-si (KR); and Hyoung Uk Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 3, 2021, as Appl. No. 17/466,458.
Claims priority of application No. 10-2021-0024911 (KR), filed on Feb. 24, 2021.
Prior Publication US 2022/0270822 A1, Aug. 25, 2022
Int. Cl. H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01G 4/008 (2006.01); C04B 35/468 (2006.01)
CPC H01G 4/1227 (2013.01) [C04B 35/4682 (2013.01); H01G 4/30 (2013.01); H01G 4/008 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component, comprising:
a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 (where, 0≤x≤1, 0≤y≤0.5), and having a plurality of grains and grain boundaries disposed between the plurality of grains, and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween;
a first external electrode connected to the first internal electrode; and
a second external electrode connected to the second internal electrode,
wherein the dielectric layer comprises a triple point disposed in contact with three grain boundaries and a secondary phase of Si disposed inside the triple point,
wherein a dispersion of an Si content at an interface between the dielectric layer and the internal electrode is 1% by weight or less.