US 11,894,191 B2
Multilayer electronic component
Jae Hoon Kim, Suwon-si (KR); Ji Hoon Kim, Suwon-si (KR); Gyoung Heon Ko, Suwon-si (KR); and Yong Hoon Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 15, 2022, as Appl. No. 17/721,808.
Claims priority of application No. 10-2021-0187671 (KR), filed on Dec. 24, 2021.
Prior Publication US 2023/0207197 A1, Jun. 29, 2023
Int. Cl. H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/012 (2013.01) [H01G 4/1227 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a first internal electrode layer including a first dielectric layer and first to fourth internal electrodes disposed to be spaced apart from each other on the first dielectric layer;
a second internal electrode layer including a second dielectric layer and a fifth internal electrode disposed on the second dielectric layer;
a body including a capacitance forming portion in which the first internal electrode layer and the second internal electrode layer are alternately disposed;
a connection electrode penetrating through the first and second internal electrode layers, spaced apart from the first to fourth internal electrodes, and connected to the fifth internal electrode;
first to fourth external electrodes disposed to be connected to the first to fourth internal electrodes, respectively, on the body; and
a fifth external electrode disposed to be connected to the connection electrode on the body.