US 11,893,196 B2
Electronic device comprising bonding layer in contact with active area of digitizer
Jeonggyu Jo, Suwon-si (KR); Jungchul An, Suwon-si (KR); and Byunghoon Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 6, 2022, as Appl. No. 17/833,107.
Application 17/833,107 is a continuation of application No. PCT/KR2022/006789, filed on May 12, 2022.
Claims priority of application No. 10-2021-0067753 (KR), filed on May 26, 2021.
Prior Publication US 2022/0382399 A1, Dec. 1, 2022
Int. Cl. G06F 3/046 (2006.01); B32B 7/12 (2006.01); B32B 3/30 (2006.01)
CPC G06F 3/046 (2013.01) [B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 2307/732 (2013.01); B32B 2457/208 (2013.01); G06F 2203/04102 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising a bonding layer in contact with an active area of a digitizer, the electronic device comprising:
the digitizer;
a flexible printed circuit board electrically connected to the digitizer; and
a bonding layer connecting the digitizer and the flexible printed circuit board,
wherein the flexible printed circuit board comprises a base part overlapping the bonding layer with respect to a stacking direction of the digitizer, the flexible printed circuit board, and the bonding layer, and an extension part extending from the base part in a direction perpendicular to the stacking direction, and a protruding part protruding toward the digitizer from the extension part.