US 11,892,968 B2
Interconnect circuit
Paul James Metzgen, London (GB)
Assigned to Silicon Tailor Limited, Putney (GB)
Filed by Silicon Tailor Limited, London (GB)
Filed on Jul. 21, 2022, as Appl. No. 17/870,715.
Claims priority of application No. 2110616 (GB), filed on Jul. 23, 2021.
Prior Publication US 2023/0023021 A1, Jan. 26, 2023
Int. Cl. G06F 15/173 (2006.01)
CPC G06F 15/17375 (2013.01) 20 Claims
OG exemplary drawing
 
1. A circuit having multiple inputs and multiple outputs the circuit being for switching signals received at any of the inputs to any of the outputs, the circuit comprising:
a first switch matrix, the first switch matrix being capable of directing signals received at the inputs of the circuit to multiple first intermediate ports;
a second switch matrix, the second switch matrix being capable of directing signals received at multiple second intermediate ports to multiple third intermediate ports, the number of the second intermediate ports being less than the number of the inputs of the circuit;
one or more primary bypass links, each primary bypass link being capable of coupling one or more of the first intermediate ports to a respective one or more of the outputs of the circuit independently of the second switch matrix;
a first redirection layer, the first redirection layer being capable of, for each of the multiple first intermediate ports, directing a signal received at that first intermediate port to a primary bypass link or to a second intermediate port; and
a second redirection layer, the second redirection layer being capable of directing signals received at each of the primary bypass links to a respective one or more outputs of the circuit, and directing signals received at each of the third intermediate ports to a respective one or more outputs of the circuit.