CPC G02B 6/43 (2013.01) [G02B 6/12002 (2013.01); G06N 10/00 (2019.01); H01L 24/47 (2013.01); H01L 25/0657 (2013.01); G02B 2006/12061 (2013.01)] | 11 Claims |
1. A device comprising:
a die stack including:
a first die including a quantum computing circuit;
a second die including an electronic circuit, wherein the second die and the first die face each other;
a first interconnect between the quantum computing circuit and the electronic circuit; and
a second interconnect between the quantum computing circuit and the electronic circuit.
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