US 11,892,497 B2
Micro device arrangement in donor substrate
Gholamreza Chaji, Waterloo (CA); and Ehsanollah Fathi, Waterloo (CA)
Assigned to VueReal Inc., Waterloo (CA)
Filed by VueReal Inc., Waterloo (CA)
Filed on Mar. 7, 2023, as Appl. No. 18/179,894.
Application 16/542,022 is a division of application No. 15/724,320, filed on Oct. 4, 2017, granted, now 10,488,455, issued on Nov. 28, 2019.
Application 18/179,894 is a continuation of application No. 16/542,022, filed on Aug. 15, 2019, granted, now 11,624,770.
Claims priority of provisional application 62/515,185, filed on Jun. 5, 2017.
Claims priority of provisional application 62/482,899, filed on Apr. 7, 2017.
Claims priority of provisional application 62/473,671, filed on Mar. 20, 2017.
Claims priority of provisional application 62/426,353, filed on Nov. 25, 2016.
Claims priority of provisional application 62/403,741, filed on Oct. 4, 2016.
Prior Publication US 2023/0341456 A1, Oct. 26, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 31/26 (2020.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); B41M 5/26 (2006.01); H05K 1/11 (2006.01); H05K 13/00 (2006.01)
CPC G01R 31/2635 (2013.01) [H01L 21/6835 (2013.01); H01L 23/544 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); B41M 5/265 (2013.01); H01L 2221/68368 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1304 (2013.01); H05K 1/111 (2013.01); H05K 13/0015 (2013.01)] 42 Claims
OG exemplary drawing
 
1. A method of populating a receiver substrate, the method comprising the steps of:
preparing a plurality of microdevices on one or more donor substrates;
transferring the plurality of microdevices from the one or more donor substrates to a first cartridge substrate, wherein the first cartridge includes three different types of micro devices and a spare micro device or a void area, the plurality of microdevices are arranged in arrays;
selecting at least one set of microdevices in the first cartridge substrate associated with a set of contact pads in the receiver substrate;
identifying a number of defective microdevices in the at least one set of microdevices;
correcting the defective microdevices if the number of defective microdevices in the set is more than a set threshold value; and
aligning and transferring the selected set of microdevices on the first cartridge substrate to corresponding contact pads on the receiver substrate.