US 11,892,343 B2
Vibration sensor
Peng Xu, Shenzhen (CN); Jian-She Feng, Shenzhen (CN); Chen-Yang Ma, Shenzhen (CN); and Jian-Li Xu, Shenzhen (CN)
Assigned to Shenzhen Fugui Precision Ind. Co., Ltd., Shenzhen (CN)
Filed by Shenzhen Fugui Precision Ind. Co., Ltd., Shenzhen (CN)
Filed on Jan. 14, 2021, as Appl. No. 17/149,488.
Claims priority of application No. 202011193329.6 (CN), filed on Oct. 30, 2020.
Prior Publication US 2022/0136892 A1, May 5, 2022
Int. Cl. G01H 11/08 (2006.01); G01R 31/12 (2020.01); H10N 30/03 (2023.01); H10N 30/87 (2023.01); H10N 30/88 (2023.01)
CPC G01H 11/08 (2013.01) [G01R 31/12 (2013.01); H10N 30/03 (2023.02); H10N 30/87 (2023.02); H10N 30/88 (2023.02)] 7 Claims
OG exemplary drawing
 
1. A vibration sensor, which is installed on a test device, comprising:
a shell, one end is open, the other end is closed surface;
a cover sheet, bonded to the open end of the shell;
a copper foil, a lower surface of the copper foil is bonded to an inner bottom surface of the closed surface of the shell;
a piezoelectric chip, a lower surface of the piezoelectric chip is bonded to an upper surface of the copper foil, and when the test device vibrates, the piezoelectric chip converts a vibration signal into a voltage response signal;
a cable, a positive electrode is welded on an upper surface of the piezoelectric chip, and a negative electrode is welded on the upper surface of the copper foil, configured to connect to an external detection device and transmit the voltage response signal to the external detection device; and
a lead block, arranged between the piezoelectric chip and the cover sheet, and configured to amplify the voltage response signal.