CPC F25B 21/02 (2013.01) [H01L 23/38 (2013.01); H10N 10/17 (2023.02); F25B 2321/0212 (2013.01)] | 30 Claims |
1. A nested thermal cooler system, the system comprising:
a first cooling assembly comprising:
a first housing;
a first cooling apparatus inside the first housing; and
a first thermal conductive layer forming a first cavity inside the first housing;
a second cooling assembly disposed within the first cavity, the second cooling assembly comprising:
a second housing;
a second cooling apparatus comprising at least one thermoelectric module embedded in the second housing; and
a second thermal conductive layer forming a second cavity inside the second housing;
a first wire wound magnetic core disposed inside the first housing;
a second wire wound magnetic core disposed outside the first housing, wherein the second wire-wound magnetic core is proximate to the first wire wound magnetic core;
a rectifier circuit in electrical communication with the first wire wound magnetic core; and
a power regulator in electrical communication with the rectifier circuit.
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