	US 11,891,687 B2
	Transparent conductor materials with enhanced near infrared properties and methods of forming thereof
Rinu Maniyara, Barcelona (ES); Prantik Mazumder, Ithaca, NY (US); and Valerio Pruneri, Barcelona (ES)
Assigned to CORNING INCORPORATED, Corning, NY (US); ICREA, Barcelona (ES); and ICFO, Castellfedels (ES)
Filed by Corning Incorporated, Corning, NY (US); ICFO—The Institute of Photonic Sciences, Barcelona (ES); and INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS, Barcelona (ES)
Filed on Sep. 30, 2020, as Appl. No. 17/038,991.
Claims priority of provisional application 62/908,079, filed on Sep. 30, 2019.
Prior Publication US 2021/0095371 A1, Apr. 1, 2021
Int. Cl. C23C 14/58 (2006.01); C23C 14/35 (2006.01); C23C 14/08 (2006.01); H01B 1/08 (2006.01)

CPC C23C 14/5806 (2013.01) [C23C 14/086 (2013.01); C23C 14/35 (2013.01); H01B 1/08 (2013.01)]

20 Claims

1. A method for producing an article, comprising:

(a) depositing a layer of transparent conductive material on a substrate, wherein the layer of the transparent conductive material has a thickness from about 20 nm to about 250 nm; and

(b) annealing the transparent conductive material at a temperature of at least about 450° C. for at least about 30 minutes,

wherein after the annealing, the transparent conductive material has a transmission of at least about 70% at 1550 nm or a Haacke figure of merit of at least about 40×10⁻⁴Ω⁻¹.