US 11,891,298 B2
Process for manufacturing microelectromechanical devices, in particular electroacoustic modules
Fabio Quaglia, Pizzale (IT); Marco Ferrera, Concorezzo (IT); and Marco Del Sarto, Monza (IT)
Assigned to STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed by STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed on Jun. 13, 2022, as Appl. No. 17/839,131.
Application 17/839,131 is a division of application No. 16/518,865, filed on Jul. 22, 2019, granted, now 11,383,971.
Claims priority of application No. 102018000007442 (IT), filed on Jul. 23, 2018.
Prior Publication US 2022/0306456 A1, Sep. 29, 2022
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 29/66 (2006.01)
CPC B81B 7/007 (2013.01) [B81B 7/008 (2013.01); B81C 1/0023 (2013.01); B81C 2203/035 (2013.01); H01L 29/66 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a coating region having a first surface and a second surface;
a dielectric region of a redistribution structure having a first surface, in contact with the first surface of the coating region, and a second surface opposite to the first surface of the dielectric region;
a die in the coating region;
a plurality of conductive regions in the coating region, extending to the first surface of the coating region, and electrically coupled to the die;
a plurality of conductive paths in the dielectric region of the redistribution structure and extending from the first surface of the dielectric region to the second surface of the dielectric region;
a plurality of conductive pillars extending outward from the second surface of the dielectric region of the redistribution structure and coupled to the plurality of conductive regions by the plurality of conductive paths;
a transduction structure including:
a plurality of pads in electrical contact with the plurality of conductive pillars; and
a plurality of membranes; and
a plurality of actuators electrically coupled to the plurality of pads.