US 11,890,881 B2
Electronic device
Yoichiro Kondo, Chino (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Aug. 2, 2022, as Appl. No. 17/817,004.
Claims priority of application No. 2021-127418 (JP), filed on Aug. 3, 2021.
Prior Publication US 2023/0039603 A1, Feb. 9, 2023
Int. Cl. B41J 29/377 (2006.01); B41J 2/335 (2006.01); B41J 2/14 (2006.01); H05K 7/20 (2006.01)
CPC B41J 29/377 (2013.01) [B41J 2/3358 (2013.01); B41J 2/1408 (2013.01); B41J 2202/08 (2013.01); H05K 7/20 (2013.01); H05K 7/20154 (2013.01); H05K 7/20163 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a substrate;
a first electronic component provided on the substrate;
a second electronic component provided on the substrate and having a thickness in a normal direction of the substrate smaller than that of the first electronic component;
a first heat conductive member in contact with the first electronic component;
a second heat conductive member in contact with the second electronic component; and
a heat sink attached to the substrate, wherein
the heat sink includes
a base portion provided so as to cover the first electronic component and the second electronic component and attached to the substrate,
a first protruding portion that protrudes from the base portion toward the first electronic component and is in contact with the first heat conductive member, and
a second protruding portion that protrudes from the base portion toward the second electronic component and is in contact with the second heat conductive member, and
a length of the first protruding portion in the normal direction is shorter than a length of the second protruding portion in the normal direction.