US 11,890,848 B2
Display device and method for bonding the same
Tae Hyun Kim, Seoul (KR); Seungmin Lee, Hwaseong-si (KR); Minjoo Kim, Bucheon-si (KR); Donghwan Shim, Hwaseong-si (KR); and Jungkyu Lee, Incheon (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Jan. 31, 2023, as Appl. No. 18/162,165.
Application 18/162,165 is a division of application No. 16/908,819, filed on Jun. 23, 2020, granted, now 11,590,748.
Claims priority of application No. 10-2019-0101302 (KR), filed on Aug. 19, 2019.
Prior Publication US 2023/0182460 A1, Jun. 15, 2023
Int. Cl. B32B 37/12 (2006.01); B32B 3/28 (2006.01); B32B 7/12 (2006.01); B32B 37/10 (2006.01); H05K 5/00 (2006.01)
CPC B32B 37/12 (2013.01) [B32B 3/28 (2013.01); B32B 7/12 (2013.01); B32B 37/10 (2013.01); H05K 5/0017 (2013.01); B32B 2457/20 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for bonding a display device, the method comprising:
disposing a display substrate, comprising a central portion and an edge portion adjacent to the central portion, on a pad disposed on a stage;
forming a lubrication layer on the display substrate;
forming an adhesive layer on the lubrication layer;
providing a window substrate comprising a planar portion and a bending portion that is bent from the planar portion;
aligning the window substrate with the display substrate;
attaching the adhesive layer to the window substrate; and
applying heat to the adhesive layer,
wherein viscosity of the adhesive layer increases during a first period for which a temperature of the adhesive layer increases from a first temperature to a second temperature.