CPC B32B 15/16 (2013.01) [B32B 5/16 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2264/1021 (2020.08); B32B 2264/1023 (2020.08); B32B 2264/12 (2013.01); B32B 2264/201 (2020.08); B32B 2264/202 (2020.08); B32B 2307/204 (2013.01); B32B 2307/302 (2013.01)] | 12 Claims |
1. A prepreg, comprising:
a reinforcing material; and
a thermosetting resin layer formed by immersing the reinforcing material in a thermosetting resin composition; wherein the thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers, based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr, the fillers include a granular dielectric filler and a flaky thermal conductive filler, and the flaky thermal conductive filler is boron nitride;
wherein a weight-average molecular weight of the liquid polybutadiene resin ranges from 1000 g/mol to 10000 g/mol, and an external diameter of the flaky thermal conductive filler ranges from 5 μm to 60 μm;
wherein the granular dielectric filler includes a supportive dielectric filler and a filling dielectric filler, a particle size of the supportive dielectric filler ranges from 30 μm to 50 μm, and a particle size of the filling dielectric filler ranges from 5 μm to 20 μm;
wherein the supportive dielectric filler is a mixture of aluminum oxide and silicon dioxide, wherein, in the supportive dielectric filler, a weight proportion of aluminum oxide to silicone dioxide ranges 5:5 to less than 8:2;
wherein the filling dielectric filler is a mixture of aluminum oxide and silicon dioxide, wherein, in the filling dielectric filler, a weight proportion of aluminum oxide to silicone dioxide ranges 2:8 to less than 5:5.
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