| CPC B29C 65/645 (2013.01) [B29C 45/0003 (2013.01); B29C 45/14311 (2013.01); B60R 13/005 (2013.01); B60R 13/04 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3005 (2013.01)] | 6 Claims |
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1. A method for manufacturing a three-dimensional structure comprising:
preparing a first structure including a fixing face;
fixing a plastic layer to the fixing face of the first structure;
preparing a conductive wire; and
operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer, and thereby partly embedding the conductive wire into the plastic layer, wherein
the fixing of the plastic layer includes
placing the first structure into a cavity of a first molding die,
injecting molten plastic onto the fixing face of the first structure in the cavity of the first molding die, and
solidifying the molten plastic to mold the plastic layer on the fixing face of the first structure,
the molding of the plastic layer includes
placing at least a part of an embedded portion of a terminal into the cavity of the first molding die and inserting an external connection portion of the terminal into an accommodation hole communicating with the cavity of the first molding die,
inserting at least the part of the embedded portion of the terminal into the molten plastic injected into the cavity of the first molding die, and
solidifying the molten plastic to insert-mold at least the part of the embedded portion of the terminal into the plastic layer,
the method further includes electrically connecting the terminal to the conductive wire,
the plastic layer includes a first face in contact with the fixing face of the first structure and a second face opposite to the first face,
a binder layer is provided on the embedded portion of the terminal,
the insert-molding of the embedded portion of the terminal includes insert-molding the embedded portion of the terminal into the plastic layer such that an exposed face of the binder layer is substantially flush with the second face of the plastic layer,
the embedding of the conductive wire includes
operating the ultrasonic head to apply ultrasonic waves onto the conductive wire and to press the conductive wire against the second face of the plastic layer, and thereby partly embedding the conductive wire into the second face of the plastic layer, and
operating the ultrasonic head to apply ultrasonic waves onto the conductive wire and bringing the conductive wire partly into contact with the exposed face of the binder layer, and
the electrical connecting of the terminal to the conductive wire includes melting the binder layer and partly exposing the embedded portion of the terminal from the binder layer to connect the conductive wire to the embedded portion of the terminal by heat swaging, welding, or soldering.
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