US 11,890,700 B2
Display module, method for manufacturing display module, and laser machining method
Youngjin Oh, Bucheon-si (KR); Sanghoon Lim, Cheonan-si (KR); Jinhyeong Kim, Asan-si (KR); Kyoungseok Cho, Suwon-si (KR); KuHyun Kang, Suwon-si (KR); and Sungjin Jang, Daejeon (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Nov. 28, 2022, as Appl. No. 17/994,699.
Application 17/994,699 is a division of application No. 16/743,527, filed on Jan. 15, 2020, granted, now 11,534,867.
Claims priority of application No. 10-2019-0042588 (KR), filed on Apr. 11, 2019.
Prior Publication US 2023/0101169 A1, Mar. 30, 2023
Int. Cl. H10K 50/86 (2023.01); H10K 50/844 (2023.01); H10K 50/80 (2023.01); B23K 26/38 (2014.01); G06F 3/041 (2006.01); H01L 21/02 (2006.01); H10K 59/40 (2023.01); H10K 71/00 (2023.01)
CPC B23K 26/38 (2013.01) [G06F 3/041 (2013.01); H01L 21/02345 (2013.01); H10K 50/86 (2023.02); H10K 59/40 (2023.02); H10K 71/00 (2023.02); G06F 2203/04107 (2013.01); H10K 50/844 (2023.02); H10K 50/868 (2023.02)] 1 Claim
OG exemplary drawing
 
1. A display module comprising:
a base layer which defines a through-hole;
a circuit layer disposed on the base layer;
an emission layer disposed on the circuit layer;
an encapsulation layer disposed on the emission layer; and
an anti-reflection layer disposed on the encapsulation layer,
wherein two or more concave portions are defined in a sidewall portion defining the through-hole.