CPC B22F 7/00 (2013.01) [B22F 1/054 (2022.01); B22F 1/056 (2022.01); B22F 1/10 (2022.01); B22F 7/064 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/8384 (2013.01)] | 9 Claims |
1. A method for producing a bonded object, comprising:
a step of preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order; and
a step of sintering the copper bonding paste under a pressure of 0.1 to 1 MPa,
wherein the copper bonding paste contains metal particles and a dispersion medium,
a content of the metal particles with respect to a total mass of the copper bonding paste is 50 mass % or more, and
the metal particles contain 95 mass % or more of submicro copper particles having a volume average particle size of 0.12 μm or more and 0.8 μm or less with respect to a total mass of the metal particles.
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