US 10,561,041 B2
Titanium thermal module
Payam Bozorgi, Santa Barbara, CA (US)
Assigned to PiMEMS, Inc., Pleasanton, CA (US)
Filed by PiMEMS, Inc., Santa Barbara, CA (US)
Filed on Sep. 20, 2018, as Appl. No. 16/137,471.
Claims priority of provisional application 62/573,778, filed on Oct. 18, 2017.
Prior Publication US 2019/0116691 A1, Apr. 18, 2019
Int. Cl. H05K 7/20 (2006.01); C01G 23/047 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); F28F 21/08 (2006.01); B82Y 30/00 (2011.01)
CPC H05K 7/20336 (2013.01) [C01G 23/047 (2013.01); F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); F28D 15/046 (2013.01); F28F 21/086 (2013.01); F28F 21/089 (2013.01); B82Y 30/00 (2013.01); F28F 2245/02 (2013.01); F28F 2255/20 (2013.01); F28F 2260/02 (2013.01); F28F 2275/04 (2013.01); F28F 2275/067 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A portable device, comprising:
a thermal module containing a vapor region and a liquid region for a working fluid, disposed within an outer casing of the portable device, wherein the thermal module comprises a titanium backplane, a vapor cavity and wicking structure formed on a metal substrate;
at least one structural element that gives the portable device strength and stiffness;
an integrated circuit chip in thermal communication with the thermal module such that heat generated by the chip is distributed throughout the portable device by the thermal module; and
wherein the thermal module is coupled mechanically to the at least one structural element by at least one of soldering, welding, swaging, bonding and gluing, adding stiffness to bending out of the primary plane of the portable device.