US 10,561,032 B2
Printing circuit board accommodation casing having engagement protrusion with crushing margin
Akitsugu Funahashi, Anjo (JP); Takeshi Tsuriki, Aichi-ken (JP); and Takahiro Suga, Kariya (JP)
Assigned to AISIN SEIKI KABUSHIKI KAISHA, Kariya-Shi, Aichi-Ken (JP)
Filed by AISIN SEIKI KABUSHIKI KAISHA, Kariya-shi, Aichi-ken (JP)
Filed on Jan. 17, 2018, as Appl. No. 15/873,500.
Claims priority of application No. 2017-007864 (JP), filed on Jan. 19, 2017.
Prior Publication US 2018/0206348 A1, Jul. 19, 2018
Int. Cl. H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 5/04 (2006.01); H05K 7/14 (2006.01)
CPC H05K 5/0047 (2013.01) [H05K 5/0226 (2013.01); H05K 5/04 (2013.01); H05K 7/1405 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A printed circuit board accommodation casing comprising:
a support surface that abuts on a first planar portion of a printed circuit board;
a side wall portion at least partially surrounding the first planar portion of the printed circuit board, the first planar portion of which is abutted by the support surface; and
an engagement protrusion formed on the side wall portion,
wherein the engagement protrusion includes a crushing margin, which is crushed against the first planar portion of the printed circuit board such that the crushing margin is changed in shape by direct pressing contact with the printed circuit board, at a location where the support surface does not abut on the first planar portion of the printed circuit board.