US 10,561,019 B2
Ecological multilayer structure for hosting electronics and related method of manufacture
Tero Heikkinen, Oulunsalo (FI); Antti Keranen, Oulunsalo (FI); Mikko Heikkinen, Oulunsalo (FI); and Jarmo Saaski, Oulunsalo (FI)
Assigned to TACTOTEK OY, Oulunsalo (FI)
Filed by TactoTek Oy, Oulunsalo (FI)
Filed on Aug. 25, 2017, as Appl. No. 15/687,157.
Prior Publication US 2019/0069403 A1, Feb. 28, 2019
Int. Cl. H05K 1/03 (2006.01); F21V 3/00 (2015.01); F21V 8/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/46 (2006.01); F21Y 115/10 (2016.01); F21Y 115/15 (2016.01)
CPC H05K 1/0313 (2013.01) [F21V 3/00 (2013.01); G02B 6/0011 (2013.01); H05K 1/0269 (2013.01); H05K 1/0274 (2013.01); H05K 1/038 (2013.01); H05K 1/181 (2013.01); H05K 3/28 (2013.01); H05K 3/284 (2013.01); H05K 3/4644 (2013.01); F21Y 2115/10 (2016.08); F21Y 2115/15 (2016.08); H05K 1/0393 (2013.01); H05K 3/4632 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01)] 28 Claims
OG exemplary drawing
 
1. An integrated multilayer structure for hosting electronics, comprising:
a 3d-formable first substrate comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side,
a plastic layer, comprising thermoplastic, molded onto said second side of the first substrate so as to at least partially cover it, and
a light source provided on the second side of the first substrate, said light source being at least partially embedded in the molded material of the plastic layer.