US 10,561,015 B2
Flexible circuit board having enhanced bending durability and method for preparing same
Sang Pil Kim, Hwaseong-si (KR); Da Yeon Lee, Hwaseong-si (KR); Hwang Sub Koo, Hwaseong-si (KR); Hyun Je Kim, Hwaseong-si (KR); and Hee Seok Jung, Hwaseong-si (KR)
Assigned to GigaLane Co., Ltd., Hwaseong-si, Gyeonggi-do (KR)
Filed by GigaLane Co., Ltd., Hwaseong-si, Gyeonggi-do (KR)
Filed on Apr. 5, 2019, as Appl. No. 16/375,947.
Application 16/375,947 is a division of application No. 15/923,070, filed on Mar. 16, 2018, granted, now 10,356,895.
Application 15/923,070 is a continuation of application No. PCT/KR2016/007593, filed on Jul. 13, 2016.
Claims priority of application No. 10-2015-0135422 (KR), filed on Sep. 24, 2015.
Prior Publication US 2019/0239344 A1, Aug. 1, 2019
Int. Cl. H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0281 (2013.01) [H05K 1/0242 (2013.01); H05K 1/115 (2013.01); H05K 3/0026 (2013.01); H05K 3/0044 (2013.01); H05K 3/06 (2013.01); H05K 3/28 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); H05K 1/024 (2013.01); H05K 1/0219 (2013.01); H05K 3/0038 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/107 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method of manufacturing flexible circuit board having enhanced bending durability, the method comprising:
(a) forming a signal line and a first ground layer on a first dielectric, and forming a second ground layer on the bottom surface of the first dielectric;
(b) preparing a second dielectric;
(c) preparing a first bonding sheet and a first protective sheet connected to one end of the first bonding sheet or positioned to overlap at least a part thereof;
(d) bonding the second dielectric on the first dielectric via the first bonding sheet;
(e) forming a via hole so that the first ground layer and the second ground layer are connected electrically; and
(f) cutting the second dielectric on the first protective sheet in the width direction.