US 10,557,199 B2
Heat treatment apparatus
Masahiro Kikuchi, Oshu (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Sep. 1, 2016, as Appl. No. 15/254,393.
Claims priority of application No. 2015-179409 (JP), filed on Sep. 11, 2015.
Prior Publication US 2017/0073811 A1, Mar. 16, 2017
Int. Cl. C23C 16/455 (2006.01); C23C 16/44 (2006.01)
CPC C23C 16/4557 (2013.01) [C23C 16/4405 (2013.01); C23C 16/45557 (2013.01); C23C 16/45578 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A heat treatment apparatus, comprising:
a substantially-cylindrical reaction tube extending in a vertical direction, and configured to accommodate a substrate holder in which a plurality of substrates is stacked in the vertical direction;
a gas supply duct integrally formed with the reaction tube on an outer circumferential wall of the reaction tube to extend in a longitudinal direction of the reaction tube;
gas supply holes configured as pipe lines to bring an interior of the gas supply duct and an interior of the reaction tube into communication with each other, the pipe lines being oriented parallel to one another to supply a gas to the substrates in a mutually-parallel relationship;
a preheating duct integrally formed with the reaction tube on the outer circumferential wall of the reaction tube, and installed so as to extend along the longitudinal direction of the reaction tube up to a predetermined position of a predetermined height existing in a vicinity of an upper end of the outer circumferential wall of the reaction tube;
a connection duct configured to connect the preheating duct and the gas supply duct; and
a pressure-resistant container configured to cover the reaction tube, the gas supply duct and the preheating duct from the outside,
wherein the gas supply holes are formed in a region of the outer circumferential wall of the reaction tube covered with the gas supply duct, and not formed in a region of the reaction tube covered with the preheating duct,
wherein a closed space is formed by the outer circumferential wall of the reaction tube and the preheating duct, and
wherein the gas supply duct and the gas supply holes are formed to cover a mounting region of the substrates mounted on the substrate holder along the longitudinal direction of the reaction tube.