US D1,010,610 S
Headset
Tseng-Feng Wen, Dongguan (CN); Hu-Ming Zheng, Dongguan (CN); Hui Xue, Dongguan (CN); and Hua-Quan Che, Dongguan (CN)
Assigned to Transound Electronics Co., Ltd., Dongguan (CN)
Filed by Transound Electronics Co., Ltd., Dongguan (CN)
Filed on Jan. 19, 2022, as Appl. No. 29/823,729.
Term of patent 15 Years
LOC (14) Cl. 14 - 01
U.S. Cl. D14—205
OG exemplary drawing
 
The ornamental design for a headset, as shown and described.