US 11,871,672 B2
3D piezoelectric polymer materials and devices
Donald J. Sirbuly, Carlsbad, CA (US); Shaochen Chen, San Diego, CA (US); Kanguk Kim, La Jolla, CA (US); and Wei Zhu, San Diego, CA (US)
Assigned to THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, Oakland, CA (US)
Filed by The Regents of the University of California, Oakland, CA (US)
Filed on Oct. 22, 2019, as Appl. No. 16/660,647.
Application 16/660,647 is a division of application No. 15/144,560, filed on May 2, 2016, abandoned.
Claims priority of provisional application 62/155,388, filed on Apr. 30, 2015.
Prior Publication US 2020/0161534 A1, May 21, 2020
Int. Cl. H01L 41/37 (2013.01); H01L 41/33 (2013.01); H01L 41/18 (2006.01); H10N 30/092 (2023.01); C08L 67/07 (2006.01); C08K 5/5419 (2006.01); C08K 3/22 (2006.01); C08K 3/04 (2006.01); H10N 30/00 (2023.01); H10N 30/08 (2023.01); H10N 30/80 (2023.01); H10N 30/85 (2023.01); H04R 17/00 (2006.01); H10N 30/853 (2023.01)
CPC H10N 30/092 (2023.02) [C08K 3/046 (2017.05); C08K 3/22 (2013.01); C08K 5/5419 (2013.01); C08L 67/07 (2013.01); H10N 30/00 (2023.02); H10N 30/08 (2023.02); H10N 30/80 (2023.02); H10N 30/852 (2023.02); H04R 17/005 (2013.01); H10N 30/8536 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A device comprising a piezoelectric material structure which includes:
a three-dimensional polymeric microstructure that includes a plurality of piezoelectric nanoparticles embedded in a photocured polymer matrix; and
acrylate containing linker molecules that covalently link the plurality of piezoelectric nanoparticles to the photocured polymer matrix,
wherein the linker molecules are trimethoxysilylpropyl methacrylate (TMSPM) linker molecules, and
wherein the piezoelectric material structure has a voltage response approximately between 400 mV and 600 mV under an applied load of 1.44N.