CPC H10N 30/092 (2023.02) [C08K 3/046 (2017.05); C08K 3/22 (2013.01); C08K 5/5419 (2013.01); C08L 67/07 (2013.01); H10N 30/00 (2023.02); H10N 30/08 (2023.02); H10N 30/80 (2023.02); H10N 30/852 (2023.02); H04R 17/005 (2013.01); H10N 30/8536 (2023.02)] | 20 Claims |
1. A device comprising a piezoelectric material structure which includes:
a three-dimensional polymeric microstructure that includes a plurality of piezoelectric nanoparticles embedded in a photocured polymer matrix; and
acrylate containing linker molecules that covalently link the plurality of piezoelectric nanoparticles to the photocured polymer matrix,
wherein the linker molecules are trimethoxysilylpropyl methacrylate (TMSPM) linker molecules, and
wherein the piezoelectric material structure has a voltage response approximately between 400 mV and 600 mV under an applied load of 1.44N.
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