US 11,871,664 B1
Staggering of openings in electrodes for crack mitigation
Robert J. Littrell, Boston, MA (US); and Karl Grosh, Boston, MA (US)
Assigned to QUALCOMM Technologies, Inc., San Diego, CA (US)
Filed by Qualcomm Technologies Inc., San Diego, CA (US)
Filed on Feb. 13, 2020, as Appl. No. 16/790,537.
Application 16/790,537 is a continuation of application No. 14/851,560, filed on Sep. 11, 2015, granted, now 10,566,517.
Claims priority of provisional application 62/049,091, filed on Sep. 11, 2014.
Int. Cl. H01L 41/083 (2006.01); H10N 30/50 (2023.01); B06B 1/06 (2006.01); H01L 21/02 (2006.01); H10N 30/87 (2023.01)
CPC H10N 30/508 (2023.02) [B06B 1/064 (2013.01); H01L 21/02104 (2013.01); H10N 30/871 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a first layer with a first opening;
a second layer with a second opening; and
at least one layer between the first and the second layers,
wherein a traversal between the first and second openings has an orientation that is substantially distinct from an orientation of an axis of the at least one layer.