CPC H05K 7/20809 (2013.01) [H05K 7/20245 (2013.01); H05K 7/20254 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H05K 7/20336 (2013.01); H05K 7/20645 (2013.01); H05K 7/20772 (2013.01); H05K 7/20818 (2013.01)] | 18 Claims |
1. A cooling system for data centre, which data centre includes a plurality of servers associated to form a rack, each server being provided with heat-generating means, said system comprising:
a primary circuit, for each server, configured to allow circulation of a first thermal carrier fluid suitable for exchanging heat with said heat-generating means, wherein said primary circuit includes a heat exchange region coupled with said heat-generating means,
a plurality of second thermosyphon circuits each one associated to a respective server of said plurality and coupled to a respective primary circuit at said heat exchange region, said plurality of second thermosyphon circuits being configured to allow circulation of a second thermal carrier fluid suitable for exchanging heat with said first thermal carrier fluid,
wherein each primary circuit includes a device comprising an evaporation portion placed thermally in contact with said heat-generating means and a condensation portion, said condensation portion being overlapped to said evaporation portion and placed thermally in contact with a respective second thermosyphon circuit of said plurality,
the overall configuration of the system being such that said plurality of second thermosyphon circuits are in fluid communication with each other according to a parallel connection.
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