CPC H05K 7/20418 (2013.01) [H01F 27/08 (2013.01); H05K 7/209 (2013.01)] | 20 Claims |
1. An apparatus comprising:
a superstructure;
a casing comprising a first heat dispersing element disposed on an external surface of the casing, wherein the casing comprises a cavity formed by an internal surface of the casing, and the casing is disposed in the superstructure comprising a second heat dispersing element;
at least one thermal pad disposed in the cavity, the at least one thermal pad being thermally conductive;
at least one inductive element;
at least one holder, wherein the holder holds the at least one inductive element; and
at least one electrically insulating pad, wherein the at least one thermal pad and the at least one electrically insulating pad are disposed between the at least one inductive element and the internal surface of the casing,
wherein the at least one holder holds the at least one inductive element over and in thermal contact with the at least one thermal pad and directs heat generated by the at least one inductive element to the first heat dispersing element.
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