US 11,871,531 B2
Computer device and host module thereof
Yung-Hsiang Chen, Taipei (TW); Marco Da Ros, Taipei (TW); Li-Wei Hung, Taipei (TW); and Li-Hsiang Chiu, Taipei (TW)
Assigned to ASUSTEK COMPUTER INC., Taipei (TW)
Filed by ASUSTEK COMPUTER INC., Taipei (TW)
Filed on Mar. 7, 2022, as Appl. No. 17/688,391.
Claims priority of application No. 110209554 (TW), filed on Aug. 13, 2021.
Prior Publication US 2023/0049278 A1, Feb. 16, 2023
Int. Cl. H05K 5/03 (2006.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 5/03 (2013.01) [H05K 5/0213 (2013.01); H05K 5/0234 (2013.01); H05K 5/0247 (2013.01); H05K 7/20136 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A host module, comprising:
a case, comprising:
a first side plate;
a second side plate, facing the first side plate;
a front panel, comprising two sides respectively adjacent to the first side plate and the second side plate;
a rear panel, located on an opposite side of the front panel, wherein the first side plate, the second side plate, the front panel, and the rear panel enclose an internal space; and
a separation structure, located in the internal space, extending from the first side plate to the second side plate, and dividing the internal space into a first part, a second part, and a third part along a vertical direction, wherein the second part is located under the first part, and the third part is located above the first part as a heat dissipation space;
a motherboard, disposed in the first part; and
a power supply unit, disposed in the second part, and electrically connected to the motherboard.