US 11,871,516 B2
Printed circuit board including coaxial plated through hole and electronic apparatus including same in wireless communication system
Kwanghyun Baek, Suwon-si (KR); Juneseok Lee, Suwon-si (KR); Dohyuk Ha, Suwon-si (KR); Youngju Lee, Suwon-si (KR); and Jinsu Heo, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 30, 2022, as Appl. No. 17/957,316.
Application 17/957,316 is a continuation of application No. 16/876,501, filed on May 18, 2020, granted, now 11,464,109, issued on Oct. 4, 2022.
Claims priority of provisional application 62/848,708, filed on May 16, 2019.
Prior Publication US 2023/0022995 A1, Jan. 26, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/11 (2006.01); H04M 1/02 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/115 (2013.01) [H04M 1/0277 (2013.01); H05K 1/0222 (2013.01); H05K 1/0243 (2013.01); H05K 1/0298 (2013.01); H05K 2201/09809 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10545 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A device of a base station, the device comprising:
a printed circuit board (PCB) including a plurality of layers;
a plurality of antennas disposed on a side of the PCB; and
a radio frequency integrated circuit (RFIC) disposed on another side of the PCB opposite to the side of the PCB,
wherein the PCB includes a coaxial plated through-hole (PTH) electrically connected with the antennas and the RFIC,
wherein the coaxial PTH includes a coaxial feedline and a plated region,
wherein the coaxial feedline is formed through a first set of layers of the plurality of layers,
wherein the plated region is formed to surround the coaxial feedline through a second set of layers and the first set of layers includes the second set of layers,
wherein the plurality of layers is divided into a plurality of stages including a first stage, a second stage, and a third stage,
wherein a dissipation factor of a material in the first stage and in the third stage is lower than a dissipation factor of a material in the second stage between the first stage and the third stage, and
wherein the second set of layers includes layers of the second stage between the first stage and the third stage.