US 11,871,510 B2
Circuit board having complementary signal conducting patterns
Hou-Yuan Chou, New Taipei (TW); Yi-Chih Wu, New Taipei (TW); Feng-Hua Deng, Wuhan (CN); and Ming-Fang Chen, Wuhan (CN)
Assigned to HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., Wuhan (CN)
Appl. No. 17/050,848
Filed by HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., Wuhan (CN)
PCT Filed Sep. 14, 2020, PCT No. PCT/CN2020/115134
§ 371(c)(1), (2) Date Oct. 27, 2020,
PCT Pub. No. WO2022/052121, PCT Pub. Date Mar. 17, 2022.
Prior Publication US 2023/0164909 A1, May 25, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/0251 (2013.01) [H05K 3/10 (2013.01); H05K 2201/09236 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A conductive pattern configured to be applied over a substrate, comprising:
a dielectric region; and
a pair of complementary conductive traces, each comprising a linear portion and a terminal portion,
wherein the linear portions of the pair of traces extend linearly abreast each other at a first separation,
wherein the terminal portions of the pair of traces are arranged adjacent to each other, and the terminal portions of the pair of complementary conductive traces are arranged in the dielectric region,
wherein the terminal portions of the pair of traces comprises a pair of circular arc profiles with a pair of complementary notches facing toward each other,
wherein a gap between the complementary notches of the terminal portions is wider than the first separation,
wherein the pair of complementary conductive traces and the dielectric region are exposed from a solder mask layer disposed over the substrate.