US 11,871,111 B2
Method and apparatus for active reduction of mechanically coupled vibration in microphone signals
Timothy Dick, San Francisco, CA (US); Eric Penrod, Brentwood, CA (US); and Erich Tisch, San Francisco, CA (US)
Assigned to GoPro, Inc., San Mateo, CA (US)
Filed by GoPro, Inc., San Mateo, CA (US)
Filed on Jan. 23, 2023, as Appl. No. 18/100,098.
Application 18/100,098 is a continuation of application No. 17/502,013, filed on Oct. 14, 2021, granted, now 11,563,894.
Application 17/502,013 is a continuation of application No. 16/710,902, filed on Dec. 11, 2019, granted, now 11,153,487, issued on Oct. 19, 2021.
Prior Publication US 2023/0156330 A1, May 18, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 23/68 (2023.01); H04R 1/34 (2006.01); G10L 21/0208 (2013.01); H04N 23/57 (2023.01)
CPC H04N 23/6812 (2023.01) [G10L 21/0208 (2013.01); H04N 23/57 (2023.01); H04N 23/685 (2023.01); H04N 23/6811 (2023.01); H04R 1/342 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
a processor configured to:
upsample a vibration signal to obtain an upsampled vibration signal, wherein the upsampled vibration signal has one or more axial components;
determine correlation values for the one or more axial components, wherein a respective axial component has a corresponding correlation value based on a microphone signal and the upsampled vibration signal;
filter the axial component corresponding to a determined highest correlation value from amongst the correlation values of the upsampled vibration signal to obtain a processed microphone signal; and
output the processed microphone signal.