US 11,870,433 B2
Solid-state multi-switch device
Rashmi Prasad, Troy, MI (US); Chandra S. Namuduri, Troy, MI (US); Muhammad H. Alvi, Troy, MI (US); and Ronald O. Grover, Jr., Northville, MI (US)
Assigned to GM Global Technology Operations LLC, Detroit, MI (US)
Filed by GM GLOBAL TECHNOLOGY OPERATIONS LLC, Detroit, MI (US)
Filed on May 4, 2022, as Appl. No. 17/736,165.
Prior Publication US 2023/0361771 A1, Nov. 9, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/057 (2006.01); H01L 25/07 (2006.01); H03K 17/687 (2006.01); H01L 23/053 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H03K 17/041 (2006.01)
CPC H03K 17/687 (2013.01) [H01L 23/053 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H03K 17/04106 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic solid-state switch assembly, comprising:
a base plate and a heat exchanger;
a thermally conducting, electrically insulating layer affixed to a bottom portion of the base plate and a direct bonded substrate affixed to the base plate;
a first terminal and a second terminal;
a plurality of power transistors;
a plurality of gate drivers;
a communication interface, a current sensor, and a snubber circuit; and
a controller;
wherein the heat exchanger includes a plurality of pin fins protruding from a bottom portion of the thermally conducting, electrically insulating layer;
wherein the plurality of gate drivers are operatively coupled to the plurality of power transistors;
wherein the plurality of power transistors are arranged in parallel on the direct bonded substrate between the first terminal and the second terminal;
wherein the plurality of power transistors are electrically connected to the first terminal and to the second terminal;
wherein the controller is in communication with the plurality of gate drivers, the current sensor, and the communication interface; and
wherein the controller is configured to control, via the plurality of gate drivers, the plurality of power transistors.