US 11,870,160 B2
Cloaked low band elements for multiband radiating arrays
Ozgur Isik, Gladesville (AU); Philip Raymond Gripo, Toongabbie (AU); Dushmantha Nuwan Prasanna Thalakotuna, Rosehill (AU); and Peter J. Liversidge, Glenbrook (AU)
Assigned to CommScope Technologies LLC, Hickory, NC (US)
Filed by CommScope Technologies LLC, Hickory, NC (US)
Filed on Dec. 29, 2022, as Appl. No. 18/147,857.
Application 18/147,857 is a continuation of application No. 17/038,070, filed on Sep. 30, 2020, granted, now 11,552,398.
Application 17/038,070 is a continuation of application No. 16/711,536, filed on Dec. 12, 2019, granted, now 10,819,032, issued on Oct. 27, 2020.
Application 16/711,536 is a continuation of application No. 16/655,479, filed on Oct. 17, 2019, granted, now 10,547,110, issued on Jan. 28, 2020.
Application 16/655,479 is a continuation of application No. 16/277,044, filed on Feb. 15, 2019, granted, now 10,498,035, issued on Dec. 3, 2019.
Application 16/277,044 is a continuation of application No. 15/517,906, granted, now 10,439,285, issued on Oct. 8, 2019, previously published as PCT/US2015/044020, filed on Aug. 6, 2015.
Claims priority of provisional application 62/081,358, filed on Nov. 18, 2014.
Prior Publication US 2023/0139294 A1, May 4, 2023
Int. Cl. H01Q 21/12 (2006.01); H01Q 5/49 (2015.01); H01Q 1/52 (2006.01); H01Q 9/16 (2006.01); H01Q 19/10 (2006.01); H01Q 21/06 (2006.01); H01Q 21/26 (2006.01); H01Q 1/24 (2006.01); H01Q 25/00 (2006.01); H01Q 21/30 (2006.01)
CPC H01Q 5/49 (2015.01) [H01Q 1/24 (2013.01); H01Q 1/523 (2013.01); H01Q 9/16 (2013.01); H01Q 19/108 (2013.01); H01Q 21/062 (2013.01); H01Q 21/26 (2013.01); H01Q 1/246 (2013.01); H01Q 1/52 (2013.01); H01Q 19/10 (2013.01); H01Q 21/06 (2013.01); H01Q 21/30 (2013.01); H01Q 25/00 (2013.01); H01Q 25/001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cross dipole radiating element, comprising:
a first dipole arm that comprises a plurality of first conductive segments and a plurality of first metallization tracks that are each on a first non-conductive substrate, where the first metallization tracks are narrower than the first conductive segments, each first metallization track electrically connecting a respective pair of the first conductive segments.